Plating process and bath

Details Plating process and bath Plating process and bath

1976-01-07

1977-12-06

Kendall, Ralph S.

Coating processes

With pretreatment of the base

Preapplied reactant or reaction promoter or hardener

427306, 106 127, 427430A, C23C 302

Patent

active

040618021

ABSTRACT:
An electroless nickel bath for applying a nickel coating to articles without heat distortion, especially plastic articles, comprising water, nickel ions, a reducing agent for reducing the nickel ions to a metal, and a stabilizing agent for controlling the operating speed of the reducing agent, the bath being maintained at an alkaline pH, with the weight of the nickel ions being less than the weight of the hypophosphite anions. The nickel ions may be obtained from nickel salts, the reducing agent may be sodium hypophosphite, and the stabilizing agent may be sodium citrate and ammonium chloride. A replenish mixture for maintaining the bath comprising nickel ions and reducing agent anions in about the same ratio as in the original bath, and a stabilizing agent in about one-third the amount as in the original bath. A method of applying a nickel coating to articles comprising immersing the articles in said electroless nickel bath at room temperature.

REFERENCES:
patent: 2532283 (1950-12-01), Brenner
patent: 3148072 (1964-08-01), West et al.
patent: 3212917 (1965-10-01), Tsu et al.
patent: 3212918 (1965-10-01), Tsu et al.
patent: 3441428 (1969-04-01), Reinhard et al.

Affiliated with

Also associated with

Rating

Plating process and bath does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Plating process and bath, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Plating process and bath will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1551445