Method for providing insulated holes in conducting substrate

Details Method for providing insulated holes in conducting substrate Method for providing insulated holes in conducting substrate

1985-07-05

1986-02-18

Anderson, Philip

Plastic and nonmetallic article shaping or treating: processes

With severing, removing material from preform mechanically,...

Making hole or aperture in article

264267, 264273, B29C 3912

Patent

active

045713227

ABSTRACT:
A method for providing insulated holes in a conductive substrate by first punching oversized holes in the substrate, then filling the holes with an insulator and then forming an aperture of a desired diameter, less than the diameter of the hole originally punched in the substrate, through the insulator to leave an annular sleeve of insulative material within each hole.

REFERENCES:
patent: 3893233 (1975-07-01), Glover
patent: 3972974 (1976-08-01), Pico
patent: 4202091 (1980-05-01), Ohnishi

Affiliated with

Also associated with

Rating

Method for providing insulated holes in conducting substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for providing insulated holes in conducting substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for providing insulated holes in conducting substrate will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1550392