Universal semiconductor chip package

Details Universal semiconductor chip package Universal semiconductor chip package

1990-11-13

1991-07-30

Picard, Leo P.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

357 74, 361412, 361414, 361420, H01L 2302

Patent

active

050361635

ABSTRACT:
Disclosed is a semiconductor chip package comprising a plurality of programmable pads located on a surface of the package, each pad being adapted for interconnection with a semiconductor chip. The package also includes a plurality of signal connectors located on a surface of the package. In addition, the package includes a plurality of signal connections, each signal connection providing an electrically conductive path between an individual programmable pad and a corresponding individual signal connector. A plurality of dedicated power or ground connectors are also located on a surface of the package. Conductive paths within the package provide apparatus for selectively connecting any programmable pad to a power or ground connector, any pad so connected also remaining connected to a corresponding signal connector.

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Ecker et al., Semiconductor Package Structure, IBM Tech. Disc. Bull., vol. 20, #8, Jan. 1979, p. 3093 & 3 Relied on Copy in 174/68.5.

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