Surface mounting module for an electric circuit board

Details Surface mounting module for an electric circuit board Surface mounting module for an electric circuit board

1992-09-02

1995-04-11

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361767, 174260, 174261, H05K 116

Patent

active

054064597

ABSTRACT:
An electric circuit board module includes a substrate with electric components mounted on one side thereof and electrodes provided on the other side thereof for the electric connection with the mounted electrical components. The electric circuit board module further includes conductor columns adhered to the electrodes and an adhesion layer provided on the other side of the substrate and around the conductor columns such that the conductor columns extrude from the adhesion layer by a predetermined length. By pressing the electric circuit board module against a separate circuit board to mount thereon, the electric components are electrically connected with electrodes of the sperate circuit board through conductor columns. Since conductor columns are made of a resinous paste with metallic powders dispersed therein, no heating operation as required in conventional module using a solder flow is necessary, resulting in that electric components are kept from the degradation caused by the heat.

REFERENCES:
patent: 3795047 (1974-03-01), Abolafia et al.
patent: 4563543 (1986-01-01), Kursuzan et al.
patent: 4715117 (1987-12-01), Enomoto
patent: 4803450 (1989-02-01), Burgess et al.
patent: 4928387 (1990-05-01), Mather et al.
patent: 5025116 (1991-06-01), Kawakami et al.
patent: 5359494 (1994-10-01), Morimoto

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