Method of adhesion of passivation layer to gold metalization reg

Details Method of adhesion of passivation layer to gold metalization reg Method of adhesion of passivation layer to gold metalization reg

1980-03-10

1982-01-12

Smith, John D.

Coating processes

Electrical product produced

Condenser or capacitor

156664, 156665, 427 91, 427125, 427 90, 430313, H01L 2148, H01L 21283

Patent

active

043105696

ABSTRACT:
A method for adhering a passivation layer to gold regions in a semiconductor device. The method comprises the steps of providing a semiconductor device having at least one gold region formed thereon. A layer of a metal reactive with the gold is then deposited over the gold region so as to form a gold-reactive metal interface region. The gold and metal are then reacted at the interface region. Any metal which does not react is removed so as to expose a reacted interface region. Finally, a layer of passivation material is deposited over the exposed reacted interface region. Because the passivation material is then in contact with reacted gold regions, its adherence thereto is substantially increased.

REFERENCES:
patent: 3567508 (1971-03-01), Cox et al.
patent: 3717563 (1973-02-01), Revitz et al.
patent: 3832230 (1974-08-01), Terry
Romankiw "Depositing Adhesion Layers for Contact Between Noble Metals and Dielectric Material", IBM Tech. Disclosure _Bulletin, vol. 18, No. 5, Oct., 1975. pp. 1635-1638.

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