Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Patent
1992-04-13
1993-12-28
Beck, Shrive
Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
427252, 427253, 427255, 4272557, 156662, C23C 1600
Patent
active
052737756
ABSTRACT:
An improved method is provided for depositing a thin copper aluminum alloy film on a patterned silicon substrate. A copper base layer conforming to the existing pattern is initially formed on the surface of the substrate, followed by contact with vapors of an aminealane compound, which causes aluminum to be selectively deposited on the copper base layer portion of the substrate. Preferably, copper is applied to a diffusion barrier surface such as tungsten using chemical vapor deposition from a complex of copper (I) perfluoroalkyl-.beta.-diketonate and an olefin or silylolefin. The entire process of developing an alloy film can be carried out without exceeding 200.degree. C.
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Dyer Paul N.
Fine Stephen M.
Norman John A. T.
Air Products and Chemicals Inc.
Beck Shrive
Dang Vi Duong
Gourley Keith D.
Marsh William F.
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