Electroless gold plating solution

Details Electroless gold plating solution Electroless gold plating solution

1990-07-09

1991-07-30

Bell, Mark L.

Compositions: coating or plastic

Coating or plastic compositions

Metal-depositing composition or substrate-sensitizing...

106 113, 252514, 427304, C23C 1844

Patent

active

050357441

ABSTRACT:
An electroless gold plating solution containing 0.1 to 10 ml/l of ethyleneamines and 0.1 to 10 g/l of hexamethylenetetramine as complexing agents in addition to the solution comprising water-soluble gold salts, pH controlling agents, catalysts, alkylamine boranes, alkali cyanides and ethylendiamine tetraacetic acid.
According to the present invention, thick coating of a gold plating film having high quality and gloss is possible and the plating time becomes very short.

Affiliated with

Also associated with

Rating

Electroless gold plating solution does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electroless gold plating solution, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electroless gold plating solution will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1540823