Mounting structure and electronic device employing the same

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type

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Details

361736, 361749, 174260, 257687, 257787, H01L 2328

Patent

active

054060273

ABSTRACT:
The present invention relates to a mounting structure adapted to be mainly used commercially and to an electronic device employing such mounting structure. A board carrying a plurality of chips is directly coated with resin to form a casing or a part thereof. Alternatively a plurality of the boards interconnected by flexible wiring sheets and coated with resin with retaining the flexibility of the wiring sheets. Such structure helps to provide a handy electric device which is required to be compact, light-weight and thin.

REFERENCES:
patent: 3039177 (1962-06-01), Burdett
patent: 4296457 (1981-10-01), Hahlganss
patent: 4364619 (1982-12-01), Inayat-Khan
patent: 4639830 (1987-01-01), Fukuoka
patent: 4781601 (1988-11-01), Kuhl et al.
patent: 5161009 (1992-11-01), Tanoi et al.
Nikkei Electronics, "Diversification of Mounting Boards", Aug. 1988, No. 454, pp. 125-144.

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