Method of mounting a piezoelectric element to a substrate using

Details Method of mounting a piezoelectric element to a substrate using Method of mounting a piezoelectric element to a substrate using

1993-11-24

1995-04-11

Ball, Michael W.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

310348, H01L 4118

Patent

active

054054761

ABSTRACT:
A method of mounting a piezoelectric element with a substrate. First, a compliant material (206) is dispensed on at least one side of the substrate (102) and cured. Next, a first conductive adhesive (216) is applied on the other side of the substrate (106). Third, a piezoelectric element (102) is positioned over the substrate (106). And thereafter, a second compliant conductive adhesive (222) is selectively dispensed such that it contacts an upper portion of one side of the piezoelectric element (102) and the substrate (106).

REFERENCES:
patent: 4666547 (1987-05-01), Snowden, Jr. et al.
patent: 4703218 (1987-10-01), Takahashi et al.
patent: 4750246 (1988-07-01), Pollard
patent: 4757581 (1988-07-01), Yamada et al.
patent: 5250870 (1993-10-01), Fenlon et al.
Conductive Elastomers Make Small, Flexible Contacts, Buchoff, Electronics, Sep. 19, 1974, pp. 122-125.

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