Process for fabricating improved bipolar transistor utilizing se

Metal working – Method of mechanical manufacture – Assembling or joining

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29579, 29587, 29590, 29591, 148 15, 148187, 156643, 156644, 156653, 204192EC, H01L 21265, H01L 21285, H01L 2131

Patent

active

043098126

ABSTRACT:
Disclosed is a self-aligned process for providing an improved bipolar transistor structure.
The process includes the chemically etching of an intermediate insulating layer to undercut another top layer of a different insulating material in a self-aligned emitter process wherein the spacing of the emitter contact to the polysilicon base contact is reduced to a magnitude of approximately 0.2 to 0.3 micrometers. In addition, in the process an emitter plug is formed to block the emitter region from the heavy P+ ion dose implant of the extrinsic base.

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