Hydrostatic clamp and method for compression type power semicond

Details Hydrostatic clamp and method for compression type power semicond Hydrostatic clamp and method for compression type power semicond

1988-12-05

1991-08-13

Hille, Rolf

Electricity: electrical systems and devices

Safety and protection of systems and devices

With specific current responsive fault sensor

357 82, 361386, 361382, 165 804, 16510433, H01L 2342, H01L 2344

Patent

active

050400517

ABSTRACT:
Hydrostatic clamping devices (20, 40) are provided to exert uniform pressure across the faces of components such as wafers (22) to constitute an integrated electronics package or power bar. The devices (20, 40) use the principle of hydrostatic pressure in a bladder (28, 41, 42) to provide uniform pressure to the faces of the components (22) through contacts (23). To permit the application of different but uniform forces to different components in a package, spreaders (34, 35) having end surfaces with unequal areas can be inserted between the bladders (28, 41, 42) and components (22) to cause the application of a different magnitude of force to the wafers (22) in a power bar.

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