Method of passivating aluminum interconnects of non-hermetically

Details Method of passivating aluminum interconnects of non-hermetically Method of passivating aluminum interconnects of non-hermetically

1983-08-22

1985-05-21

Hearn, Brian E.

Metal working

Method of mechanical manufacture

Assembling or joining

29588, 29589, 148 627, 427 88, H01L 2188, H01L 2192, H01L 2194, H01L 2156

Patent

active

045177341

ABSTRACT:
Aluminum metal runs and bonding pads on an integrated circuit die are passivated, subsequent to wire bonding of the circuit die to a lead frame, by immersing the lead frame and wire-bonded die in hot deionized water for approximately 60 minutes.

REFERENCES:
patent: 3247428 (1966-04-01), Perri et al.
patent: 3681147 (1972-08-01), Dhaka et al.
patent: 3935083 (1976-01-01), Tomozawa et al.
patent: 3986897 (1976-10-01), McMillan et al.
patent: 4089709 (1978-05-01), Harris
"Application of Aluminum Oxide to Integrated Circuits Fabrication", by Harada et al., IEEE Transactions on Reliability, vol. R-25, No. 5, Dec. 1976.

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