Low loss, thick film metallizations for multilayer microwave pac

Details Low loss, thick film metallizations for multilayer microwave pac Low loss, thick film metallizations for multilayer microwave pac

1996-07-11

1998-04-28

Le, H. Thi

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Including a second component containing structurally defined...

428328, 428329, B23B 516

Patent

active

057442320

ABSTRACT:
A thick film metallization compatible with low temperature cofired ceramics (LTCC) that displays very low microwave insertion losses commensurate with those of thin film gold. However, the disclosed metallization is applied similar to conventional metallizations by screen printing and has no limit to the number of layers achievable. The electrical performance of the metallization is attained by using a spherical metal particle shape and uniform particle size distribution in the thick film paste. The advantage of this invention is that superior microwave performance can be achieved in electronic packages without the cost and limitations imposed by thin film metallization techniques.

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patent: 5021293 (1991-06-01), Huang et al.
patent: 5175031 (1992-12-01), Ochocki
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