Plastic article or earthenware shaping or treating: apparatus – Distinct means to feed – support or manipulate preform stock...
Patent
1997-05-12
1998-04-28
Nguyen, Khanh P.
Plastic article or earthenware shaping or treating: apparatus
Distinct means to feed, support or manipulate preform stock...
118641, 118600, 118213, 118255, 118256, 118406, 26427217, H05K 310, H05K 322
Patent
active
057441715
ABSTRACT:
System for producing a plurality of semiconductor device assemblies utilizing a grid array of conductive epoxy for connecting them to an electronic system. Conductive epoxy is screen printed in a desired pattern onto a printed wire board of the semiconductor device assembly. The conductive epoxy is B-staged by heating in an oven. The semiconductor device assembly is then placed onto a system printed circuit board wherein the B-staged conductive epoxy is further cured by heat and effectively makes mechanical and electrical connections between the semiconductor device assembly and the system printed circuit board.
REFERENCES:
patent: 3656232 (1972-04-01), Hinchey
patent: 3706840 (1972-12-01), Moyle et al.
patent: 4304536 (1981-12-01), Davis et al.
patent: 4362486 (1982-12-01), Davis et al.
patent: 4514752 (1985-04-01), Engel et al.
patent: 4919970 (1990-04-01), Hoebener et al.
patent: 5117069 (1992-05-01), Higgins
patent: 5249101 (1993-09-01), Frey et al.
patent: 5306546 (1994-04-01), Schreiber et al.
patent: 5332439 (1994-07-01), Watanabe et al.
patent: 5397916 (1995-03-01), Normington
patent: 5431863 (1995-07-01), Mochizuki et al.
Electronic Engineer Times, p. 48, Apr. 6, 1992.
LSI Logic Corporation
Nguyen Khanh P.
LandOfFree
System for fabricating conductive epoxy grid array semiconductor does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with System for fabricating conductive epoxy grid array semiconductor, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and System for fabricating conductive epoxy grid array semiconductor will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1530080