Thermoplastic film die attach adhesives

Details Thermoplastic film die attach adhesives Thermoplastic film die attach adhesives

1991-08-09

1993-04-20

Michl, Paul R.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

At least one aryl ring which is part of a fused or bridged...

524430, 524433, 252500, 252518, 437217, 437220, 439 86, 439524, C08K 338

Patent

active

052043991

ABSTRACT:
This is a thermally conductive adhesive having excellent die shear strength, in film form, and having a weight average molecular weight of about 100,000 to 150,000, prepared from a mixture of a dietherdianhydride, a meta-substituted benzenediamine, a polysiloanediamine, and a thermally conductive filler, that is suitable as a die attach adhesive: it bonds rapidly without the need for curing or baking off-line; does not produce excess stress on the die; requires no refrigeration; provides uniform bond line thickness between the die and paddle; can be used at temperatures that do not oxidize copper lead frames or produce excessive thermal stress; can be reworked; and can exert adequate adhesion during the processes of wire bonding and molding.

REFERENCES:
patent: 4395527 (1983-07-01), Berger
patent: 4518735 (1985-05-01), Goodrich et al.
patent: 4652598 (1987-03-01), Edelman
patent: 4670325 (1987-06-01), Bakes et al.
patent: 4810563 (1989-03-01), DeGree
patent: 4869954 (1989-09-01), Squitieri
patent: 4994207 (1991-02-01), Edelman et al.

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