Stock material or miscellaneous articles – Coated or structually defined flake – particle – cell – strand,... – Particulate matter
Patent
1990-12-11
1993-04-20
Stoll, Robert L.
Stock material or miscellaneous articles
Coated or structually defined flake, particle, cell, strand,...
Particulate matter
264 47, 503213, B01J 1318, B41M 5165
Patent
active
052041859
ABSTRACT:
A process for producing melamine-formaldehyde microcapsules using a reactive protective colloid is provided. The reactive protective colloid is prepared by reactively coupling a surface active polymer with a first melamine-formaldehyde pre-condensate. An aqueous solution which includes the reactive protective colloid and a second melamine-formaldehyde pre-condensate is then prepared. A substance to be encapsulated, preferably an oily solution containing a dyestuff precursor, is dispersed as droplets into the aqueous solution. The reactive protective colloid surrounds the droplets to form an emulsion. The second melamine-formaldehyde pre-condensate and the reactive protective colloid are made to self-condense to form melamine-formaldehyde microcapsule walls around the droplets of the substance to be encapsulated.
REFERENCES:
patent: 4396670 (1983-08-01), Sinclair
patent: 4406816 (1983-09-01), Sliwka
patent: 4409156 (1983-10-01), Hoshi et al.
patent: 4562116 (1985-12-01), Okada et al.
patent: 4574110 (1986-03-01), Asano et al.
patent: 4824823 (1989-04-01), Pietsch et al.
patent: 4965025 (1990-10-01), Pietsch et al.
patent: 5011634 (1991-04-01), Pietsch et al.
Covert John M.
Stoll Robert L.
The Standard Register Company
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