Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1997-04-25
1998-11-10
Phillips, Michael W.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361761, 361764, 361772, 361774, 257692, 257696, 257723, 257724, 174225, 174261, H01R 2368
Patent
active
058353585
DESCRIPTION:
BRIEF SUMMARY
BACKGROUND OF THE INVENTION
The invention is directed to a power supply module for equipping an assembly pc board, whereby the individual components are arranged on a module pc board.
In modern system technology, DC/DC frequency converters are increasingly accommodated directly on the system assemblies for the supply of electronic circuits.
The typical efficiency of a DC/DC frequency converter amounts to about 80 percent. About 20 percent of the converted power must be eliminated as heat by the converter itself. The dissipated heat mostly arises in the crystal of the power semiconductor. A frequency converter can only be optimized in size when one succeeds in transporting and distributing its dissipated heat from the pronounced "hot spots" to the surface without greater temperature differences. In the ideal case, the surface of the frequency converter is dimensioned exactly according to its dissipated power under predetermined ambient conditions.
In addition to the module size, heat elimination and temperature distribution, further problems such as, for example, weight, assembly outlay, mechanical loads, etc., arise in the realization.
In the standard module technology, electrical components are on one or more small, epoxy printed circuit boards. The heat transport ensues from the "hot spots" via a casting compound to the surface of the housing. In addition to the high manufacturing costs, a considerable added weight thereby arises. The result thereof is a strong stressing of the fastening pins during a transport and due to other vibrations. Additionally, such modules must be mechanically fixed on the printed circuit board (with screws, clamps, etc.), this involving further costs.
In some instances, hybrid technology is applied instead of the epoxy boards. The electrical and mechanical contacting thereby ensues via a few strong terminal pins. For reasons of mechanical stabilization of substrate and terminal pins, such hybrids are accommodated in a housing and cast out. The above-described problems thereby arise. In some embodiments, the stiff terminal pins are stabilized via specific frame structures and fixed to the housing and the substrate.
All of these known techniques involve substantial disadvantages as well as high manufacturing costs. Moreover, such modules are not optimally heated since the lower surface practically always lies on the assembly pc board in order to save structural height. The air throughput is greatly impeded as a result thereof, so that the optimum size of the module cannot be achieved.
SUMMARY OF THE INVENTION
The object of the present invention is comprised in finding an optimum overall solution for the fashioning of such power supply modules.
This object is inventively achieved for a power supply module of the species initially cited in that the active components are arranged in open structure on a ceramic plate produced with thick-film technology that serves as module pc board; in that two rows of adequately thin and long terminal pins are arranged at two opposite edges of the ceramic plate, whereby the spacing between the terminal pins is minimal, and the terminal pins are conducted horizontally away in extension of the underside of the ceramic plate and comprise U-shaped bent-out portions in their middle region; and in that the module is arranged in a clearance of the assembly pc board, whereby the underside of the ceramic plate aligns with the underside of the assembly pc board.
The manufacture of the inventive power supply module can be implemented with low outlay. As a result of the open structure, the heat elimination problems are reliably solved. The power supply module is reliably and elastically carried by the two rows of adequately thin and long terminal pins. Curvatures and deformations of the module pc board caused by heating, mechanical warping, etc., are thereby easily intercepted. Further, the air throughput can occur unimpeded to the farthest-reaching extent. An optimum heat elimination is thereby achieved given a minimal structural height.
The mechanical l
REFERENCES:
patent: 3201655 (1965-08-01), Bradt et al.
patent: 3287795 (1966-11-01), Chambers et al.
patent: 3480836 (1969-11-01), Aronstein
patent: 4413308 (1983-11-01), Brown
patent: 5095406 (1992-03-01), Buschmann et al.
patent: 5317479 (1994-05-01), Pai et al.
Paten Abstracts of Japan, vol. 18, No. 88 (E-1507) 14 Feb. 1994, & JP 05-292744 dated 05 Nov. 1993.
Phillips Michael W.
Siemens Aktiengesellschaft
Vigushin John B.
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