Method for forming deposited film

Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

427 55, 427402, B05D 306

Patent

active

048063860

ABSTRACT:
An apparatus for forming a deposited film comprises a chamber, which can be brought into a reduced pressure, for forming a deposited film on a substrate by introducing a starting gas into said chamber and decomposing or polymerizing said gas, the apparatus is provided with both a means for decomposing or polymerizing said gas by discharging and a means for decomposing or polymerizing said gas by heat.

REFERENCES:
patent: 4401689 (1983-08-01), Ban
patent: 4532196 (1985-07-01), Yasui et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method for forming deposited film does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for forming deposited film, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for forming deposited film will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1521205

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.