Integrated circuit test head

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

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G01R 102

Patent

active

058349464

ABSTRACT:
An integrated circuit test head assembly includes a group of circuit modules arranged in a circle, with the heat sinks carried by each of the modules located on the outside of the circle. The circuit modules are contained within a test head housing. Conductive pins extend downwardly from each of the modules and contact a probe card directly, without the need for an adapter. The circuit boards are cooled by flowing a cooling medium, typically a gas, around the outside of the circle of modules, so that all of the heat sinks are evenly cooled.

REFERENCES:
patent: 4517512 (1985-05-01), Petrich et al.
patent: 4590538 (1986-05-01), Cray, Jr.
patent: 4880050 (1989-11-01), Nakamura et al.
patent: 4962444 (1990-10-01), Niggemann
patent: 5153815 (1992-10-01), Suzuki et al.
patent: 5216361 (1993-06-01), Akar et al.

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