Single step electrical/mechanical connection process for connect

Details Single step electrical/mechanical connection process for connect Single step electrical/mechanical connection process for connect

1992-12-31

1994-04-19

Ramsey, Kenneth J.

Metal fusion bonding

Process

Plural diverse bonding

H05K 330

Patent

active

053038622

ABSTRACT:
A single step electrical/mechanical connection process utilizes an adhesive layer (3 or 26) that is patterned on a substrate (1 or 21) to mechanically connect adjacent substrates in a multilayered structure (28) or to connect a pin (2) assembly to a device (5). In a preferred embodiment, the adhesive layer (3 or 26) and substrate (1 or 21) are made from materials which will undergo transesterification under heat and pressure to create a very strong bond therebetween. The adhesive layer (3 or 26) is positioned around and does not cover the solder (4) in the pin connector assembly or the alignment holes (24) in the molding/sheet (21), thereby allowing bonding metallurgy to make positive electrical connections between pins (2) and pads (6) and adjacent spheres (22) in a multilayered structure (28).

REFERENCES:
patent: 4157932 (1979-06-01), Hirata
patent: 4751126 (1988-06-01), Oodaira et al.
patent: 5031308 (1991-07-01), Yamashita et al.
patent: 5046238 (1991-09-01), Daigle et al.
patent: 5199163 (1993-04-01), Ehrenberg et al.

Affiliated with

Also associated with

Rating

Single step electrical/mechanical connection process for connect does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Single step electrical/mechanical connection process for connect, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Single step electrical/mechanical connection process for connect will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-15195