Wet micro-channel wafer chuck and cooling method

Details Wet micro-channel wafer chuck and cooling method Wet micro-channel wafer chuck and cooling method

1992-05-22

1993-04-20

Davis, Jr., Albert W.

Heat exchange

With retainer for removable article

Electrical component

165 805, 16510432, 165917, 361385, H01L 23473

Patent

active

052034011

ABSTRACT:
A wet micro-channel wafer chuck (10) holds a semiconductor wafer 12 having a plurality of high powered chips (14) held in place with vacuum provided in the chuck (10). The chuck (10) has a plurality of micro-channels (16), which extend along cooling fins (18), on which the semiconductor wafer (12) rests when it is held in place on the chuck. A water supply manifold (20) extends perpendicular to the micro-channels (16) across the chuck (10). Water supply slot (22) extends upward from the water supply manifold into the micro-channels (16). Similarly, water exit slots (24) extend upward from water exit manifolds (26) into the micro-channels (16). Water (28) is delivered from pump (30) of an external recirculator/chiller (32) to the supply manifold (20) and into the many micro-channels (16) that pass under the wafer (12) under test. The water (28) leaves the micro-channels (16), enters the exit slots (24) and then the exit manifolds (26), from which it is returned to the recirculator/chiller (32). Reservoir or tank (34) of the recirculator/chiller (32) is connected to a regulated vacuum source (36). By applying a vacuum, the pressure in the cooling loop is lowered below atmospheric, and the wafer (12) under test is held against surface (38) of the chuck (10).

REFERENCES:
patent: 4278230 (1981-07-01), Allen
patent: 4287941 (1981-09-01), Allen
patent: 4775003 (1988-10-01), Koh
patent: 4897762 (1990-01-01), Daikoku et al.
patent: 5088006 (1992-02-01), Puerto et al.

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