Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – Flexible panel
Patent
1987-04-09
1989-02-21
Arbes, Carl J.
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
Flexible panel
29611, 29620, 29827, 174 524, 346 75, 439 70, 439 71, H05K 100, H01R 4300
Patent
active
048061069
ABSTRACT:
Disclosed herein is a method and apparatus for interconnecting a flexible (flex) circuit, printed circuit or the like to an ink jet printhead or other similar electronic device. This approach includes providing a flexible lead frame member between the flex circuit and printhead, with the lead frame member having a plurality of conductive leads or fingers extending at a predetermined angle with respect to the final plane of interconnection. During the interconnection process, these leads or fingers are spring biased through this predetermined angle to provide good compressive electrical contact between the two members interconnected by the lead frame in a single plane of interconnection.
REFERENCES:
patent: 3755892 (1973-09-01), Dieterich
patent: 3803709 (1974-04-01), Beltz et al.
patent: 3808506 (1974-04-01), Lang
patent: 3890702 (1975-06-01), Lane, III
patent: 3952410 (1976-04-01), Garretson et al.
patent: 4155615 (1979-05-01), Zimmerman, Jr. et al.
patent: 4680859 (1987-07-01), Johnson
patent: 4701781 (1987-10-01), Sankhagowit
Chan Lawrence W.
La Duong T.
Mebane Janet E.
Nevarez Ruben
Arbes Carl J.
Bethurum William J.
Hewlett--Packard Company
LandOfFree
Interconnect lead frame for thermal ink jet printhead and method does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Interconnect lead frame for thermal ink jet printhead and method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Interconnect lead frame for thermal ink jet printhead and method will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1519329