Method for tensioning ID saw blades and an apparatus for monitor

Details Method for tensioning ID saw blades and an apparatus for monitor Method for tensioning ID saw blades and an apparatus for monitor

1995-11-14

1997-06-24

Britton, Howard W.

Television

Special applications

Manufacturing

73104, 125 1302, 348141, H04N 718

Patent

active

056421591

ABSTRACT:
We disclose: (1) a method for tensioning an ID saw blade, which comprises observing position of the cutting edge of the ID saw blade by using a CCD camera, exhibiting the observed position of the cutting edge of the ID saw blade on a display, adjusting tensioning screws while the position of the cutting edge of the ID saw blade exhibited on the display is watched, and disposing the cutting edge of the ID saw blade at a position within a preset allowable range which is exhibited on the display; and (2) an apparatus for monitoring tensioning of an ID saw blade which comprises a CCD camera for observing the position of the cutting edge of the ID saw blade, a display for exhibiting the observed position of the cutting edge of the ID saw blade, and a mechanism for exhibiting on the display an allowable range for the position of the cutting edge of the ID saw blade which is set in advance. Because the position of the cutting edge of the ID saw blade can be always watched on a display during the operation of tensioning, the operation of tensioning does not require a high degree of expertise, fatigue of an operator is slight, and efficiency and accuracy of the operation are improved.

REFERENCES:
patent: 4991475 (1991-02-01), Malcok et al.
patent: 5235960 (1993-08-01), Malcok
patent: 5257101 (1993-10-01), Lee
patent: 5303687 (1994-04-01), Steere
patent: 5552822 (1996-09-01), Nallakrishnan
Y. Koyama et al., "Diamond Tooling for the Electronics Industry", Industrial Diamond Review, Feb. 1982, pp. 77-79.
C. Stephens, "New Developments in Wafering Technology", Industrial Diamond Review, Feb. 1982, pp. 64-66.

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