Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Patent
1976-10-22
1979-01-02
Smith, John D.
Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
204192C, 427 91, 427 92, 427 93, 427 94, 427124, 427383A, 427383B, C23L 1302
Patent
active
041328132
ABSTRACT:
The provision of a supplementary layer of nickel by an electroless process in order to provide solder wetting capability for a tempered aluminum-nickel metallization is made unnecessary by causing the layer of nickel deposited on an underlying aluminum metallization layer to have a thickness between 0.6 and 1.0 .mu.m and by conducting the subsequent tempering operation between 400 and 480.degree. C, preferably 475.degree. C, for a period of between 10 and 20 minutes, preferably 15 minutes. In order to provide high transverse conductivity, the aluminum layer should have a thickness between 3 and 10 .mu.m. The process is useful in the manufacture of semiconductor devices as well as for making electrical devices based on an insulating substrate.
REFERENCES:
patent: 3479736 (1969-11-01), Toki et al.
patent: 3579375 (1972-05-01), Wonilowicz
patent: 3633269 (1972-01-01), Bachmeier
patent: 3806361 (1974-04-01), Lehner
patent: 3922385 (1975-11-01), Konantz et al.
patent: 3965279 (1976-06-01), Levinstein
Robert & Bosch GmbH
Smith John D.
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