Positive photosensitive resin composition and electronic apparat

Details Positive photosensitive resin composition and electronic apparat Positive photosensitive resin composition and electronic apparat

1997-05-16

1999-01-12

Chu, John S.

Radiation imagery chemistry: process, composition, or product th

Imaged product

Including resin or synthetic polymer

430192, 430193, 430326, 430330, G03F 7023

Patent

active

058585842

ABSTRACT:
A highly reliable positive type photosensitive resin composition composed of diamine having a carboxyl group as a structural unit, which can be developed with an alkaline aqueous solution, comprising polyamic acid ester having hydrophobic group, o-quinonediazidesulfonyl amide compound, and/or o-quinonediazidesulfonyl amide sulfonic ester compound, and electronic devices using the same. A polyamide film having preferable positive type relief patterns, of which the unexposed portion is not corroded, can be obtained.

REFERENCES:
patent: 4774171 (1988-09-01), Zahn et al.
patent: 5441845 (1995-08-01), Okinoshima et al.
patent: 5518864 (1996-05-01), Oba et al.
patent: 5573886 (1996-11-01), Kato et al.

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