Nickel/gold plating of a copper-refractory metal material

Details Nickel/gold plating of a copper-refractory metal material Nickel/gold plating of a copper-refractory metal material

1997-10-14

1999-01-12

Gorgos, Kathryn

Stock material or miscellaneous articles

All metal or with adjacent metals

Composite; i.e., plural, adjacent, spatially distinct metal...

428675, 427405, 427438, 4274331, 427319, 427320, 427305, 205181, 205184, 205187, 205191, 205210, 205212, 205215, 205917, 205 50, B32B 1520, B05D 136, C25D 512, C23C 2802

Patent

active

058585575

ABSTRACT:
A copper-tungsten or copper-molybdenum substrate is plated with a nickel/gold plating by first activating a surface of the substrate. In activating, the surface is contacted to a concentrated alkaline solution at elevated temperature, and then to a concentrated acidic solution. The surface is thereafter plated with a nickel strike layer, plated with a nickel primary layer overlying the nickel strike layer, sintered, re-activated in a concentrated acidic solution, plated with a nickel secondary layer overlying the nickel primary layer, and plated with a gold layer overlying the nickel secondary layer.

REFERENCES:
patent: 4960493 (1990-10-01), Troup

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