Method for preparing vias for subsequent metallization

Details Method for preparing vias for subsequent metallization Method for preparing vias for subsequent metallization

1996-11-08

1998-11-10

Breneman, R. Bruce

Cleaning and liquid contact with solids

Processes

Including application of electrical radiant or wave energy...

216 65, 216 13, 216 17, 438751, 438708, B08B 312, B44C 122, H01B 1300

Patent

active

058337598

ABSTRACT:
The invention relates to a method for cleaning vias in electronic component substrates prior to metallization thereof.

REFERENCES:
patent: 5470617 (1995-11-01), Nishii et al.
patent: 5628926 (1997-05-01), Belgacem et al.

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