Wiring substrate

Details Wiring substrate Wiring substrate

1995-07-21

1996-07-02

Ledynh, Bot L.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361709, 361760, 361776, 361789, 361794, 361813, 257700, 257690, H05K 100, H01R 2368, H01L 2348

Patent

active

055329063

ABSTRACT:
A wiring substrate includes a ceramic substrate having a first conductive connection pattern on an lower surface of the ceramic substrate and a second conductive connection pattern on an upper surface or the lower surface of the ceramic substrate, a multilayered wiring portion arranged on the lower surface of the ceramic substrate through the first conductive connection pattern and including an insulating layer made of an organic polymer, on which an integrated circuit and/or a circuit part are/is mounted, and a flexible wiring substrate, connected to the second conductive connection pattern, for connecting the integrated circuit and/or the circuit part to an external circuit.

REFERENCES:
patent: 4855869 (1989-08-01), Tsuti
patent: 5031025 (1991-07-01), Brun et al.
patent: 5055914 (1991-10-01), Shimizu et al.
patent: 5081005 (1992-01-01), Lin et al.
patent: 5153709 (1992-10-01), Fukuoka
patent: 5196725 (1993-03-01), Mita et al.
patent: 5315486 (1994-05-01), Fillion et al.
"RELIABILITY EVALUATION OF SILICON ON SILICON MULTICHIP MODULES", Kenji Okajima, IMC 1992 Proceedings, Yokohama, pp. 533, Jun. 5, 1992.

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