Apparatus for polishing semiconductor wafers

Details Apparatus for polishing semiconductor wafers Apparatus for polishing semiconductor wafers

1977-02-28

1979-01-02

Godici, N. P.

Abrasive tool making process, material, or composition

With carbohydrate or reaction product thereof

51216LP, B24B 3704

Patent

active

041320379

ABSTRACT:
Semiconductor wafer polishing apparatus is described having a sheet of wafer mounting material on its carrier to rigidly hold a plurality of wafers to be polished during the polishing operation. The mounting material includes a lamina of a polymeric material which exhibits surface wetting characteristics to aid in adhering the back side of wafers thereto and a lamina of a volume compressible material which absorbs without wafer deformation any asperities on the back side of such wafers.

REFERENCES:
patent: 3449870 (1969-06-01), Jensen
patent: 3453783 (1969-07-01), Queen
patent: 3841031 (1974-10-01), Walsh

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