Metal working – Method of mechanical manufacture – Electrical device making
Patent
1997-04-15
1998-11-10
Arbes, Carl J.
Metal working
Method of mechanical manufacture
Electrical device making
29840, 257620, 257665, 438 14, 438 18, H01K 900
Patent
active
058326014
ABSTRACT:
Resilient contact structures are mounted directly to bond pads on semiconductor dies, prior to the dies being singulated (separated) from a semiconductor wafer. This enables the semiconductor dies to be exercised (e.g., tested and/or burned-in) by connecting to the semiconductor dies with a circuit board or the like having a plurality of terminals disposed on a surface thereof. Subsequently, the semiconductor dies may be singulated from the semiconductor wafer, whereupon the same resilient contact structures can be used to effect interconnections between the semiconductor dies and other electronic components (such as wiring substrates, semiconductor packages, etc.). Using the all-metallic composite interconnection elements of the present invention as the resilient contact structures, burn-in can be performed at temperatures of at least 150.degree. C., and can be completed in less than 60 minutes.
REFERENCES:
patent: 5389556 (1995-02-01), Rostoker et al.
patent: 5442282 (1995-08-01), Rostoker et al.
patent: 5539325 (1996-07-01), Rostoker et al.
patent: 5648661 (1997-07-01), Rostoker et al.
Eldridge Benjamin N.
Grube Gary W.
Khandros Igor Y.
Mathieu Gaetan L.
Arbes Carl J.
Form Factor, Inc.
Larwood David J.
Linden Gerald E.
LandOfFree
Method of making temporary connections between electronic compon does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of making temporary connections between electronic compon, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of making temporary connections between electronic compon will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1504922