Method of mounting electronic parts

Details Method of mounting electronic parts Method of mounting electronic parts

1997-05-14

1998-11-10

Vo, Peter

Metal working

Method of mechanical manufacture

Electrical device making

29414, 29415, 29840, 29852, 26427217, 438107, 438126, 438127, H05K 332, H05K 342, H05K 708, H01L 2156

Patent

active

058326006

ABSTRACT:
A method for manufacturing a leadless package type electronic part, the cost and the size of which can be reduced and which exhibits excellent reliability. The electronic part of a leadless package type includes a rectangular substrate having a plurality of external electrodes in the periphery thereof, an element part placed on the surface of the substrate while being electrically connected to the external electrodes, and molding resin for molding the element part onto the surface of the substrate, wherein the surface of the molding resin is formed to be flat, and each side surface of the molding resin is flush, or aligned, with a respective side surface of the substrate.

REFERENCES:
patent: 3926746 (1975-12-01), Hargis
patent: 4264917 (1981-04-01), Ugon
patent: 4530152 (1985-07-01), Roche et al.
patent: 4790894 (1988-12-01), Homma et al.
patent: 5182853 (1993-02-01), Kobayashi et al.
patent: 5273938 (1993-12-01), Lin et al.
patent: 5355283 (1994-10-01), Marrs et al.
patent: 5373627 (1994-12-01), Grebe

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