Method of interfacing detector array layers

Details Method of interfacing detector array layers Method of interfacing detector array layers

1997-03-26

1998-11-10

Vo, Peter

Metal working

Method of mechanical manufacture

Electrical device making

29831, 29852, 29DIG22, 22818022, 427 97, H05K 334, H05K 302, H05K 342

Patent

active

058325999

ABSTRACT:
An alignment board for interfacing arrays of infrared detectors to a multi-layer module concerns an insulating board having a multiplicity of conductive vias with insulating sealing plugs and enlarged metallic pads that are attached to the ends of the vias. Preferably, an insulating layer is formed on opposing sides of the board. Openings are delineated in the layer coinciding with the metallic pads, and preferably solder contacts are deposited in the openings. A multi-layer module may be attached to one side of the alignment board using reflow solder processes. Then, arrays of infrared detectors may be attached to the opposing side of the alignment board using a lower-temperature reflow soldering process. The alignment board facilitates the interfacing and assembly of the focal plane of infrared detection systems.

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