Contacting structure with respect to spherical bump

Details Contacting structure with respect to spherical bump Contacting structure with respect to spherical bump

1995-09-07

1997-06-24

Thomas, Laura

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

114260, 361772, 361774, 439 82, H05K 116

Patent

active

056419457

ABSTRACT:
A contacting structure with respect to a spherical bump in which the spherical bump is to be contacted with a contact pin, the contact pin includes a contacting portion supported by a resilient support element, and the contacting portion is arranged in opposite relation to that part of a spherical surface of the spherical bump other than a lower-most point thereof. The contacting portion has a projection capable of pressing into the spherical surface of the spherical bump, and also has a pressure receiving surface for setting an amount by which the projection presses into the spherical surface.

REFERENCES:
patent: 3530422 (1970-09-01), Goodman
patent: 5227812 (1993-07-01), Watanabe et al.
patent: 5349495 (1994-09-01), Visel et al.
patent: 5386344 (1995-01-01), Beaman et al.
patent: 5398166 (1995-03-01), Yonezawa et al.
patent: 5410807 (1995-05-01), Bross et al.
patent: 5484964 (1996-01-01), Dawson et al.
patent: 5489750 (1996-02-01), Sakemi et al.

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