Multilayer interconnection structure for a semiconductor device

Details Multilayer interconnection structure for a semiconductor device Multilayer interconnection structure for a semiconductor device

1995-09-05

1996-10-01

Jackson, Jr., Jerome

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

257773, 257774, 257775, 257776, H01L 2348

Patent

active

055613276

ABSTRACT:
A multilayer interconnection structure for a semiconductor device improving the integration degree of the semiconductor device and reducing the contact resistance. This interconnection structure comprises a lower interconnection layer having a predetermined constant width, an insulating layer provided on the lower interconnection layer and having a contact hole which is vertically placed on the lower interconnection layer and has a width larger than that of the lower interconnection layer, and an upper interconnection layer laid on the insulating layer such that it is connected to the lower interconnection layer through the contact hole. The upper interconnection layer has an enlarged portion at each side of or at only a side of its section corresponding to the contact hole. The enlarged portion extends toward a longitudinal direction of the lower interconnection layer.

REFERENCES:
patent: 4587549 (1986-05-01), Ushiku
patent: 4656732 (1987-04-01), Teng et al.
patent: 4716452 (1987-12-01), Kondoh et al.
patent: 4916521 (1990-04-01), Yoshikawa et al.

Affiliated with

Also associated with

Rating

Multilayer interconnection structure for a semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Multilayer interconnection structure for a semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multilayer interconnection structure for a semiconductor device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1503841