Electrical interconnect system with wire receiving portion

Electrical connectors – Contact comprising cutter – Insulation cutter

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

H01R 909

Patent

active

059513209

ABSTRACT:
An electrical interconnect component and system is disclosed. The electrical interconnect component and system includes a support element, an array of groups of multiple receiving-type electrically conductive contacts held by the support element, each of the receiving-type electrically conductive contacts having a contact portion and tail portion. The receiving-type electrically conductive contacts of each group of contacts are circumferentially arranged such that a projection-type interconnect component may be received therein. The contact portion of each receiving-type electrically conductive contact is adapted to contact a corresponding electrically conductive contact of the projection-type interconnect component. The tail portion of each receiving-type electrically conductive contact includes a blade having a forked end that is adapted to receive and provide electrical contact to a wire. The blades of the electrically conductive contacts within each group being parallel to each other.

REFERENCES:
patent: 3337838 (1967-08-01), Damiano et al.
patent: 3366915 (1968-01-01), Miller
patent: 3444506 (1969-05-01), Wedekind
patent: 3848221 (1974-11-01), Lee, Jr.
patent: 4274700 (1981-06-01), Keglewitsch et al.
patent: 4487463 (1984-12-01), Tillotson
patent: 4572604 (1986-02-01), Ammon et al.
patent: 4616406 (1986-10-01), Brown
patent: 4648673 (1987-03-01), Endo et al.
patent: 4654472 (1987-03-01), Goldfarb
patent: 4655526 (1987-04-01), Shaffer
patent: 4698663 (1987-10-01), Sugimoto et al.
patent: 4734042 (1988-03-01), Martens et al.
patent: 4897055 (1990-01-01), Jurista et al.
patent: 4943846 (1990-07-01), Shirling
patent: 4959750 (1990-09-01), Cnyrim et al.
patent: 4975066 (1990-12-01), Sucheski et al.
patent: 4997376 (1991-03-01), Buck et al.
patent: 5015207 (1991-05-01), Koepke
patent: 5037311 (1991-08-01), Frankeny et al.
patent: 5071363 (1991-12-01), Reylek et al.
patent: 5081563 (1992-01-01), Feng et al.
patent: 5088934 (1992-02-01), Chow et al.
patent: 5117069 (1992-05-01), Higgins, III
patent: 5123164 (1992-06-01), Shaheen et al.
patent: 5137456 (1992-08-01), Desai et al.
patent: 5281151 (1994-01-01), Arima et al.
patent: 5309024 (1994-05-01), Hirano
patent: 5326936 (1994-07-01), Taniuchi et al.
patent: 5330372 (1994-07-01), Pope et al.
patent: 5334279 (1994-08-01), Gregoire
patent: 5342999 (1994-08-01), Frei et al.
patent: 5351393 (1994-10-01), Gregoire
patent: 5371404 (1994-12-01), Juskey et al.
patent: 5376825 (1994-12-01), Tukamoto et al.
patent: 5390412 (1995-02-01), Gregoire
AMP Product Guide, Printed Circuited Board Connectors 3, pp. 3008, 3067-3068, 3102-3103, 3122-3123.
George D. Gregoire, "3-Dimensional Circuitry Solves Fine Pitch SMT Device Assembly Problem;" Connection Technology.
George D. Gregoire, "Very Fine Line Recessed Circuitry--A New PCB Fabriction Process".
Robert Barnhouse, "Bifurcated Through-Hole Technology--An Innovative Solution to Circuit Density," Connection Technology, pp. 33-35 (Feb., 1992).
AMP Product Information Bulletin, "AMP-ASC Interconnection Systems," pp. 1-4 (1991).
AMP Product Guide, "Micro-Strip Interconnection System," pp. 3413-3414 (Jun., 1991).
Du Pont Connector Systems Product Catalog A, "Rib-Cage II Through-Mount Shrouded Headers" and "Micropax Board-to-board Interconnect System," pp. 2-6, 3-0, 3-1 (Feb., 1992).
R.R. Tummala et al., "Microelectronics Packaging Handbook," Van Nostrand Reinhold, 1989, pp. 38-43, 398-403, 779-791, 853-859, and 900-905.
Intel Corporation, "Packing," pp. 2-36, 2-96, 2-97, 2-100, 3-2, 3-24, and 3-25; (1993).

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Electrical interconnect system with wire receiving portion does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electrical interconnect system with wire receiving portion, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electrical interconnect system with wire receiving portion will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1503226

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.