Method of soldering an integrated circuit and printed circuit bo

Details Method of soldering an integrated circuit and printed circuit bo Method of soldering an integrated circuit and printed circuit bo

1986-07-28

1988-05-03

Jordan, M.

Metal fusion bonding

Process

Plural joints

2281802, 228179, B23K 3100, B23K 3102

Patent

active

047414723

ABSTRACT:
A method of soldering an integrated circuit with yielding connecting contacts rigidly mounted on the integrated circuits to printed circuit boards. The integrated circuit is inserted in a clamped manner into a formed opening in a printed circuit board and the connecting contacts are soldered with the conductors by means of customary soldering methods for mass production such as by wave soldering.

REFERENCES:
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patent: 4110917 (1978-09-01), LeGrelle
patent: 4222622 (1980-09-01), Griffin et al.
patent: 4272140 (1981-06-01), Lychyk et al.
patent: 4326765 (1982-04-01), Brancaleone
patent: 4346952 (1982-08-01), Bright et al.
patent: 4538864 (1985-09-01), Ichimura
patent: 4541676 (1985-09-01), Hansen et al.
patent: 4556267 (1985-12-01), Senor
patent: 4557540 (1985-12-01), Forbes et al.
patent: 4566624 (1986-01-01), Comerford
patent: 4582245 (1986-04-01), Cartwright
patent: 4630875 (1986-12-01), Korsunsky

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