Semiconductor device having a supporting lead to support a bypas

Details Semiconductor device having a supporting lead to support a bypas Semiconductor device having a supporting lead to support a bypas

1996-01-19

1997-07-15

Saadat, Mahshid D.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257674, H01L 23495

Patent

active

056486812

ABSTRACT:
A semiconductor device includes a semiconductor chip having electrode pads on the semiconductor chip, the electrode pads including a predetermined electrode. A plurality of leads are electrically connected to the electrode pads on the semiconductor chip, the leads including a predetermined lead electrically connected to the predetermined electrode. A resin package encloses the semiconductor chip and partially encloses the leads. A bypass lead portion electrically connects one of the leads, not adjacent to the predetermined electrode, to a location adjacent to the predetermined electrode, the bypass lead portion being enclosed in the resin package. A supporting lead supports the bypass lead portion such that the supporting lead prevents a deformation of the bypass lead portion, the supporting lead being enclosed in the resin package.

REFERENCES:
patent: 5276352 (1994-01-01), Komenaka et al.
patent: 5424576 (1995-06-01), Djennas et al.
patent: 5457341 (1995-10-01), West

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