Methods and apparatus for bonding an article to a metallized sub

Details Methods and apparatus for bonding an article to a metallized sub Methods and apparatus for bonding an article to a metallized sub

1979-12-19

1981-10-20

Weidenfeld, Gil

Metal fusion bonding

Process

Plural joints

228 6A, 228242, 228264, B23K 112, H01S 2160

Patent

active

042955963

ABSTRACT:
A chip carrier (5) having a plurality of first ends (21--21) is aligned with and bonded to mating lands (34--34) on a PCB substrate (31) by positioning the carrier in a recess of a nozzle (66) on the tool and directing individual streams of hot gas horizontally onto the terminals and lands to cause previously deposited solder thereon to reflow to bond the articles together. Alternatively, articles bonded with reflowable material may be de-bonded in a like manner.

REFERENCES:
patent: 3534462 (1967-08-01), Cruickshank et al.
patent: 3696229 (1972-10-01), Angelucci et al.
patent: 3776394 (1973-12-01), Miller
patent: 3793710 (1974-02-01), Monahan et al.
patent: 3920949 (1975-11-01), Clawson et al.
Trollman, "Solder Reflow Tool", IBM Tech. Disclosure Bulletin, vol. II, No. 10, Mar. 1969, p. 1298.
Greer, "Low Expansivity Organic Substrate", 11 (p. 170), Proceedings of the 28th Electronics Components Conference, Anaheim, Calif., Apr. 1978.
Markstein, Electronic Packaging and Production, Apr. 1979, pp. 79-84.
Settle, Capt. R. E., Solid State Technology, Jun. 1978, pp. 54-58.
Balde, Computer Magazine, Dec. 1977, pp. 58-68.
Prokop et al., Third Quarterly Report, Contract No. F33615-78-C-5147, Patterson AFB, Oh., Jul. 15, 1979.
"PAK-X-TRAC", Brochure, New Concepts Systems, Colmar, Pa., 1975.

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