Product of pillar alignment and formation process

Details Product of pillar alignment and formation process Product of pillar alignment and formation process

1988-02-26

1991-06-18

Wojciechowicz, Edward J.

357 71, H01L 2348

Patent

active

050253034

ABSTRACT:
A process for the formation of pillars (28) in connection with the fabrication of a semiconductor device (10) is disclosed. The process first aligns a lead pattern (30) with an existing structure (24) in the semiconductor device (10). Next, the process aligns a pillar pattern (32) with the lead pattern (30). These two patterns (30, 32) are then transferred downward into respective conductive layers (26, 28) of the semiconductor device (10). An insulating layer (34) is deposited over the conductive layers (26, 28) and etched-back to expose a portion of the pillar (28). A conductive layer (42) is applied over the exposed pillar (28).

REFERENCES:
patent: 4799093 (1989-01-01), Kohara et al.
patent: 4814841 (1989-03-01), Masuoka et al.
patent: 4851895 (1989-07-01), Green et al.

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