Semiconductor assembly, method of manufacturing same, and bondin

Details Semiconductor assembly, method of manufacturing same, and bondin Semiconductor assembly, method of manufacturing same, and bondin

1975-07-10

1977-01-25

Wojciechowicz, Edward J.

357 17, 357 65, 357 68, H01L 3300, H01L 2348, H01L 2944, H01L 2948

Patent

active

040054578

ABSTRACT:
A semiconductor assembly devoid of wire bonds presents economies of manufacture and is especially suited for light emitting diodes. The semiconductor assembly comprises a semiconductor, an electrode-containing substrate supporting the semiconductor, and an electrode-containing cover supported by the semiconductor. Novel cure-shrinkable adhesive means incorporating an oxide remover (preferably a halogen) physically bonds together the semiconductor and the cover electrode.

REFERENCES:
patent: 3622419 (1971-11-01), London et al.
patent: 3812406 (1974-05-01), Henri
patent: 3930912 (1976-01-01), Wisbey

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