Semiconductor device having a solderable contacting coating on i

Details Semiconductor device having a solderable contacting coating on i Semiconductor device having a solderable contacting coating on i

1976-03-26

1977-01-25

James, Andrew J.

357 67, 357 68, 29588, 29589, 29590, H01L 2348, H01L 2940, H01L 2946, H01L 2962

Patent

active

040054543

ABSTRACT:
A semiconductor device which is resistant against alternating thermal stres in which a disc of semiconductor material, which is provided with at least one pn-junction and with solderable contacting coatings on its opposite major surfaces, has these coatings permanently connected, in a direct planar manner, with current conducting connections by means of a soft solder. The soft solders employed are tin solders containing 3 to 8% antimony, 0.1 to 2% nickel, remainder tin, or 3 to 8% antimony, 0.1 to 3% copper, 0.1 to 2% cadmium, remainder tin, or 1 to 6% silver, 0.1 to 2% cadmium, remainder tin; cadmium solders containing 10 to 25% zinc, 1 to 5% silver, remainder cadmium, or 10 to 25% zinc, 5% silver, 3% copper, remainder cadmium; zinc solders containing 10 to 25% cadmium, 0.1 to 3% copper, remainder zinc; and lead solders containing 10 to 20% cadmium, 0.3 to 5% antimony, remainder lead, or 1 to 5% silver, 0.5 to 2% tin, 0.1 to 2% nickel, 0.1 to 3% copper, remainder lead.

REFERENCES:
patent: 3046651 (1962-07-01), Olmon et al.
patent: 3137595 (1964-06-01), Datalong
patent: 3414969 (1968-12-01), Blum et al.
patent: 3429040 (1969-02-01), Miller
patent: 3584265 (1971-06-01), Nier
patent: 3680196 (1972-08-01), Leinkram
patent: 3930306 (1976-01-01), Goldberg et al.

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