Process for preparing a film of densely packed structure

Details Process for preparing a film of densely packed structure Process for preparing a film of densely packed structure

Filed on

1978-01-23

Date issued

1980-06-24

Examiner

Parrish, John A.

Patent Class

Plastic and nonmetallic article shaping or treating: processes

SubClass

Including step of generating heat by friction

Other Related Categories

264 63, 264 66, 264320, C04B 3564

Type

Patent

Status

active

Patent number

042094771

Description

ABSTRACT:
A process for preparing dielectric or semiconductive films which have densely packed structures. In a process comprising spreading a powdery ceramic material suspended in a binder and solvent on to a base plate to form a thin layer and subjecting the layer to firing, the improvement being provisionally firing the thin layer to remove the binder and solvent, cooling the resulting thin layer, covering the thin layer with an organic film, compressing the thin layer and the film to densely pack the thin layer and to adhere the thin layer to the film, prior to the firing.

REFERENCES:
patent: 3192086 (1965-06-01), Gyurk
patent: 3538571 (1970-11-01), Callahan et al.
patent: 3540894 (1970-11-01), McIntosh
patent: 3943994 (1976-03-01), Cleveland

Affiliated with

Also associated with

Rating

Process for preparing a film of densely packed structure does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for preparing a film of densely packed structure, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for preparing a film of densely packed structure will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1480387