Semiconductor package and computer using it

Details Semiconductor package and computer using it Semiconductor package and computer using it

1989-04-03

1992-03-17

James, Andrew J.

357 80, 357 81, H01L 2312, H01L 2182

Patent

active

050973185

ABSTRACT:
A cavity-down type package for a semiconductor device comprises an insulating base substrate on which the semiconductor device and another insulating cap substrate with plural outer connection terminals on its outer surface and with electrodes provided on conductive layers for electric conduction on its inner surface. The electrodes on the insulating base substrate and those on the insulating cap substrate are connected with each other by using conductive material such as bumps.

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Cicone et al., "Silicon Integrated High Performance Package", vol. 27, No. 7B, Dec./84, p. 4226.
"Common Substrate Design for Wirebond/Hermetic VLSI Devices", IBM TDB, vol. 27, No. 11, Apr./85, p. 6366.
"Silicon Integrated High Performance Package", IBM TDB, vol. 27, No. 7B, Dec./84, p. 4226.

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