Resin-sealed semiconductor device

Details Resin-sealed semiconductor device Resin-sealed semiconductor device

Filed on

1990-07-13

Date issued

1992-03-17

Examiner

James, Andrew J.

Other Related Categories

357 67, 357 73, 357 80, C08K 334, C08K 300, H01L 2328

Type

Patent

Status

active

Patent number

050973177

Description

ABSTRACT:
A resin-sealed semiconductor device includes a semiconductor element mounted on a die frame, bonding wires and external wires connected to the bonding wires. The semiconductor element, the bonding wires and portions of the external leads are coated with porous silica gel impregnated with a sealing resin.

REFERENCES:
patent: 4633573 (1987-01-01), Sherer
patent: 4720424 (1988-01-01), Eickman et al.
patent: 4876232 (1989-10-01), Barkatt
The 38th Netsu-Koka-Sei-Jushi Koen-Toron-Kai Koen-Yoshi-Shu, pp. 123-126.
CHEMISTRY from Kagaku Dojin, vol. 44, No. 9, Sep. 1989, pp. 597-603, S. Sakka, "Sol-Gel Technique", (with partial English translation).

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