Wafer transfer apparatus

Material or article handling – Miscellaneous

Patent

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Details

294 64R, 414404, 414416, 414730, 414732, 414737, B65G 1732

Patent

active

044936060

ABSTRACT:
Apparatus for placing a first element at a receptacle location on a second element, there being associated with the precise receptacle location some known variation in the shape of the second element, the apparatus comprising a support member for supporting the first element while the member is translated toward the second element along a placement direction, a first transport device for moving the support member or the second element along a direction transverse to the placement direction, and a sensing device located on the support member for sensing the relative alignment along the transverse direction of the support member and the variation in shape, the sensing device comprising an energy-beam source adapted and positioned to direct an energy beam along a path that interacts with the variation in shape at least when the support member and receptacle location are aligned so that more of the beam is transmitted along the path when the member and receptacle location are aligned than when the member and receptacle are not aligned and an energy beam sensor adapted and positioned to detect the difference in the amount of the beam transmitted along the path.

REFERENCES:
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patent: 4222166 (1980-09-01), Kurek et al.
Semiconductor Production, Autumn 1980, New Automatic Wafer Handling Equipment for Semi Standard Plastic Carriers, Guy Mongodin.

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