Process for sensitizing articles for metallization and resulting

Coating processes – With pretreatment of the base – Preapplied reactant or reaction promoter or hardener

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427305, 427306, 106 111, C23C 302

Patent

active

044501900

ABSTRACT:
Surfaces of articles are sensitized for the deposition of adherent metal from electroless metal solutions in contact therewith by prior treatment with an activatable complex of copper in a liquid medium formed from a solution comprising a mixture of halogen, cuprous and cupric components and thereafter forming a deposit on the treated article surfaces of a water-insoluble derivative of the said complex. Such surface deposits are treated with a reducing agent or water to enhance their reception of metal in an electroless metal deposition bath.

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