Metal fusion bonding – Including means to apply flux or filler to work or applicator
Patent
1999-09-01
2000-07-04
Ryan, Patrick
Metal fusion bonding
Including means to apply flux or filler to work or applicator
228260, 228262, 347 76, 347 77, 222590, 2391022, B23K 100, B23K 3102, B23K 3512, B41J 209, B05B 108
Patent
active
060826053
ABSTRACT:
A solder jet apparatus is disclosed. The solder jet apparatus is a continuous mode solder jet that includes a blanking system and raster scan system. The use of the raster scan and blanking systems allows for a continuous stream of solder to be placed anywhere on the surface in any desired X-Y plane. This allows for greater accuracy as well as greater product throughput. Additionally, with the raster scan system, repairs to existing soldered surfaces can be quickly and easily performed using a map of the defects for directing the solder to the defects.
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Micro)n Technology, Inc.
Ryan Patrick
Stoner Kiley
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