Substrate for mounting electric parts

Geometrical instruments

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Details

29832, 361414, H05K 118

Patent

active

044497695

ABSTRACT:
Two substrates carrying printed circuit patterns are coupled together back-to-back with an adhesive tape interposed therebetween. A plurality of holes are formed through the substrates, and apertures of small diameter are punched in the portions of the adhesive tape backing these holes. Electric components to be held to the substrate are then inserted through the holes punched in the adhesive tape and soldered firmly into portion by an automatic soldering apparatus.

REFERENCES:
patent: 2982883 (1961-05-01), Gordy
patent: 3149265 (1964-09-01), Thorn
patent: 3228091 (1966-01-01), Rice
patent: 4095866 (1978-06-01), Merrill
patent: 4242720 (1980-12-01), Moore

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