Through hole circuit board interconnect

Metal working – Method of mechanical manufacture – Electrical device making

Patent

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Details

29834, 29837, 29843, 439 82, 439 83, H05K 334, H05K 338, H01R 900

Patent

active

060819960

ABSTRACT:
In a preferred embodiment, a through hole connector pin for a circular through hole defined through a printed circuit board substrate, including: a vertical cylindrical portion of the connector pin for insertion in the circular through hole, the vertical cylindrical portion having a diameter less than that of the circular through hole; and a horizontal offset head portion of the connector pin formed integrally with the vertical cylindrical portion, the horizontal offset head portion having a shape approximating that of a conductive pad disposed on an upper surface of the printed circuit board substrate.

REFERENCES:
patent: 4592137 (1986-06-01), Tanaka et al.
patent: 5637835 (1997-06-01), Matern
patent: 5909011 (1999-06-01), Chartrand et al.
IBM Techincal Disclosure Bullentin, vol. 8, No. 11, "Module Terminal Pin and Land Structure", J.A. Antenucci, Apr. 1966.

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