Method of electroplating a conductive layer over an electrolytic

Details Method of electroplating a conductive layer over an electrolytic Method of electroplating a conductive layer over an electrolytic

1974-12-23

1976-12-28

Tufariello, T. M.

Chemistry: electrical and wave energy

Processes and products

204 42, 204231, C25D 554, C25D 700

Patent

active

040000460

ABSTRACT:
A method is provided for electroplating a solid electrolyte film-forming metal capacitor. The method includes placing an electroprocessed capacitor in an electroplating vessel which contains a plating source and electroplating solution, providing a voltage source and connecting the positive terminal of the voltage source to the anode side of the capacitor and to the plating source and the negative terminal of the voltage source to a conducting layer on the anode body, and then electroplating a layer containing metal over the capacitor. Any metal which can be plated may be used, such metals include electrically conductive metals such as silver, gold, copper, nickel, and mixtures thereof. The electroplated layer over the capacitor provides greater resistance to mechanical shock and allows the welding of a cathode termination means to the electroplated layer of the capacitor.

REFERENCES:
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patent: 2930951 (1960-03-01), Burger et al.
patent: 3231800 (1966-01-01), Scherr et al.
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patent: 3292053 (1966-12-01), Giacomo
patent: 3316463 (1967-04-01), Comado et al.
patent: 3343047 (1967-09-01), Comado et al.
patent: 3439231 (1969-04-01), Booe
patent: 3850764 (1974-11-01), Herczog

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